Easy to Use
The VisionMaster A600™ is the latest fully automatic, set-and-forget Solder Paste Inspection (SPI) system for monitoring and tweaking your solder paste printing process. The system is unbelievably easy to use. You simply open a Gerber file and select the components that need to be measured by dragging the mouse. And then with a single click, the system takes over, automatically finding fiducials, identifying pads and filing away height and volume data for each pad. Color coded pads on the Gerber data show pads outside the thresholds in real-time. Historical data for the board is available at the your fingertips by sliding a simple slider back and forth. Zooming into the Gerber data you can swoop into 3D views of the pads. Data is presented in intuitive ‘exploding’ charts for SPC. Solder Paste Inspection data presentation doesn’t get any more intuitive!
With measurement speeds of up to 17 cm²/sec, a typical board can be inspected 100% in less than 30 seconds. And this speed is achieved with an amazingly high 10μm lateral resolution and accuracy.
Plug and Play
Completely plug-and-play with any modern Windows™ desktop or laptop that has a Gigabit Ethernet port.
The A600™ is low maintenance and is designed to give years of trouble-free usage. The sensor and mounting components are machined from aircraft grade aluminum. To ensure consistent high quality, more than 95 percent of sensor and power supply components are sourced within the United States and the motion system is sourced from Japan.
State-of-the-art xy motion allows totally automatic and seamless scanning of PCB panels up to 460 x 400 mm. The z-axis motion allows for auto-focus of the sensor and board warpage compensation. The system uses a laser stripe that keeps the board in focus in real-time independent of the 3D data acquisition.
As with all other VisionMaster equipment, the A600™ uses advanced white light and infra-red structured light scanning to build height data for every pixel in the view. Long life, solid-state LEDs are used for projection and background lighting. Advanced CMOS image sensors are immune to electrical analog noise resulting in very repeatable measurements. Gigabit connectivity means fast, reliable and easy connection to the PC.
The A600™ uses the most advanced VisionMaster software to date, making full use of modern multi-core processors and available GPU (video card) massive parallelism to speed up processing and user-responsiveness.
All the user needs to do is load a Gerber 274-X file. The software uses enhanced parametric processing to recognize all pads and fiducials in the Gerber data. It also automatically groups pads and labels components based on the IPC-7351B component naming standards.
All current and historical pad height and volume data is stored in independent board files that easily can be copied, grouped and archived.
Fully customizable, colorful 3D plots are produced using graphical hardware optimized rendering. These plots can be rotated and zoomed into for inspecting solder pads from all possible angles. Smart grid resolution increases the detail displayed as the user zooms in. The height features can be exaggerated with a simple slider bar to enhance the appearance of variations like dog ears on top of solder paste.
Custom and standard color palettes can be chosen to color code 3D data based on user selected pass/fail and warning thresholds. Photo-realistic 3D shading also is available that superimposes the camera image on the 3D data.
Statistical process control (SPC) charts are built directly into the software. Features like height and volume can be selected easily for display. Different data sets can be created intuitively and an easy auto-scroll option is available at the flick of the mouse pointer to view historic data. The chart data is stored in simple-to-store and edit text files that also can be imported easily into any spreadsheet for further analysis.
Microsoft Windows 7/8/10 (64 bit)
Gigabit Ethernet port
500MB hard disk space
1366 x 768 screen resolution
Board Warpage Compensation
|Image Sensor||5 megapixel monochrome CMOS 12-bit, 2592×1944 pixels|
|Field of View (FOV)||26mm × 19.5mm|
|Measurement Range||25μm to 400μm|
|Inspection Speed||17 cm²/sec|
|Board Warpage Compensation||Laser stripe, real-time autofocus|
|FOV Measurement Time||0.3 seconds, Intel® Core i7 3.0 GHz|
|Measurements Reported||Volume, Area, Height, Offset, Bridging|
|Gauge Repeatability and Reproducibility||Calibration Standard: <2% (tolerance +/-20%, 50μm minimum)
Typical Solder Brick: <<10% (tolerance +/-20%, 50μm minimum)
|Motion Travel||450mm × 400mm × 50mm (Standard Travel)
600mm × 450mm × 50mm (Extended Travel; option for large PCBs)
|Motion Resolution||10μm. Optical encoders on all axes.|
|Motion Speed||150mm/sec maximum|
|Power||40W nominal, 100W maximum, <2W standby, 90V-240V 50/60 Hz|
|Connectivity||Gigabit Ethernet 1000Base-T Cat 5e/6, RJ-45|
|Operating Conditions||Temperature 10° to 35°C, humidity <90% non-condensing|
|Weight||Standard Travel: Net 45 kg, gross 90 kg
Extended Travel: Net 50 kg, gross 100 kg
Dimensions in mm.